Blog

Allen Field preps for Dieline show in June

What better place to join a revolution than in Boston? Packaging design will be transformed during the second annual Dieline Package Design Conference in Boston June 22-25—and Allen Field will be there! Last year’s inaugural conference drew almost 900 attendees from all parts of the packaging design industry and this year should be bigger and better!

The staff at Allen Field looks forward to reconnecting with old friends and making new ones, all while discussing packaging design and the inherent challenges and opportunities faced by designers. Most of all, while we love Boston and this annual conference, we can’t wait to return home with the lessons we learned about design, brand reinvention and working on a tight budget and begin passing them on to our customers!

To learn more about the Dieline Package Design Conference, click here. Learn more about Allen Field—and how we are eager to assist you with your packaging design needs!

 

 

 

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